STRENGTHENING. STABILITY. The ASUS TUF GAMING H670-PRO WIFI D4 homeboard uses all the most important elements of the latest Intel® processors and combines them with features that improve gaming and proven reliability. Thanks to the use of military equipment, improved power supply and efficient cooling system, it offers the highest reliability and stability for gaming marathons. In terms of appearance, the TUF GAMING H670-PRO WIFI D4 homeboard stands out for the new TUF Gaming logo and a design with simple geometrical elements that emphasizes its reliability and stability – i.e. the characteristics of the TUF Gaming series equipment. CONSTRUCTION OF THE SYSTEM The integrated VRM has power phases DrMOS 14+1, which in one package combine MOSFET transistors with high capacity and low capacity gates, as well as drivers, providing the power and performance necessary to meet the large requirements of Intel Core 12 generation processors. The integrated Digi+ (VRM) voltage control module is one of the best systems of this type in the industry, constantly providing a very smooth supply to the power processor with incredible cleanliness. The use of a multi-layer plate optimises cooling of the most important components, providing greater flexibility in overclocking the processor above factory speeds. FOLLOWING CONSTRUCTION The VRM radiator - a heat sink with extensive surface area and significant mass cools VRM components and chokes, improving the efficiency of heat scattering. The PCH radiator - the enlarged surface of the chipset radiator maximizes the efficiency and efficiency of heat scattering. Three M.2 sockets with radiators - three of the four M.2 sockets have dedicated radiators that keep the M.2 SSDs at optimal temperatures during operation, ensuring their constant performance and reliability. MAJOR RESPONSIBILITIES Improvements in the deployment of signal paths provide Intel's latest processors with better access to memory bandwidth. OptiMem II technology from ASUS intelligently redirects memory signals on paths passing between different areas of the printed board, reducing the length of paths, and adding shielded zones that allow for a significant reduction of interpathal auditions. Three Nests PIE 4.0 M.2 Three M.2 PCIe 4.0 sockets support up to two devices[...]